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Description
- Adopts high-quality 3D NAND wafer level chip.
- Supports PCIe3.0 x4 and NVMe 1.3 protocol.
- All-metal cooling plate is included; equipped with intelligent temperature control technology.
- Adopts TRIM to improve read/write performance and speed.
- Supports Max. Write technology for full-disk SLC cache.
- Supports LDPC ECC to enhance data reliability.
- Low power consumption management.